Ultra-low profile design for maximum system clearance
With a total height of just 33.21 mm, the FIT V series is specifically engineered for space-constrained builds. Large dual-tower CPU air coolers and small form factor (SFF) Mini-ITX chassis often restrict memory height, but these 288-pin UDIMM modules slide easily underneath bulky heatsinks. The minimalist Jet Black aluminum heat dissipator provides efficient thermal management while maintaining a clean, hardware-focused look that matches any modern motherboard.
Tight CL30 timings at 6000 MT/s for responsive gaming
Operating at 6000 MT/s with tight CL30-36-36-76 timings, this memory kit minimises data transfer bottlenecks for modern processors. The low latency of CL30 ensures that the CPU receives critical data with minimal delay, which directly translates to smoother frame rates and reduced stuttering in demanding games. Running at 1.35V, this kit delivers the high bandwidth required for intensive multitasking, content creation, and high-refresh-rate gaming.
Universal Intel XMP 3.0 and AMD EXPO overclocking
Configuring this memory to its rated speed is straightforward thanks to built-in support for both Intel XMP 3.0 and AMD EXPO overclocking profiles. Users can easily apply the optimised 6000 MT/s profile through the motherboard BIOS without manual timing adjustments. For baseline compatibility, the kit also features a standard SPD speed of 4800 MT/s at 1.1V with 40-40-40-77 timings, ensuring a reliable first boot on any compatible DDR5 platform.
Engineered for long-term stability and peace of mind
To maintain data integrity under heavy workloads, the FIT V modules feature On-die Error Correcting Code (ECC), which automatically detects and corrects single-bit errors in real-time. An integrated Power Management IC (PMIC) resides directly on the module to regulate power distribution more efficiently than older DDR4 designs. Backed by a Limited Lifetime Warranty, this memory kit is rigorously tested to ensure long-term durability and consistent performance.